PCB007 Magazine - I-Connect007
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Connecting at the Speed of 5G What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, are we there yet? Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era. May 2018 Summary What truly defines 5G, as compared to 4G and 3G? As the children say on road trips, are we there yet? Find out what is here, and what’s on the horizon for the industry and the world when it comes to the dawn of the 5G era. Features —an Approaching Megatrend, by Dan Feinberg , by Stig Kallman by I-Connect007 Editorial Team , by Prismark Partners LLC , by Patty Goldman Columns and Articles by Todd Kolmodin by Jan Pedersen by Michael Carano , by Steve Williams by John Mitchell (Presented in Shanghai, March 2018) by Happy Holden Close January 2017 01/09/20173D Printing & Structural Electronics 3D printing is happening, and it’s happening fast. What does this mean for PCB manufacturing and structural electronics? Find out this month in The PCB Magazine! January 2015 Summary This month, The PCB Magazine feature contributors, including Dr. Jon Harrop (IDTechEx), Arjen Koppens (Dima Group B.V.), Karl D.D. Willis, Ph.D. (Autodesk), and Simon Fried (NanoDimension Ltd.) explore 3D printing and structural electronics. Find out what these technologies are bringing to the industry, plus columns, news highlights, events and MORE! Features by Arjen Koppens, Dima Group, B.V. , by Dr. Jon Harrop, IDTechEx , by Karl D.D. Willis, Ph.D., Autodesk , by Simon Fried, NanoDimension Ltd. Columns , by Ray Rasmussen , by Karl Dietz , by Mike Carano , by Steve Williams , by Todd Kolmodin Close March 2014 03/05/2014IPC APEX EXPO 2019 Preview In this issue, we provide a preview of the upcoming IPC APEX EXPO 2019 events, exhibitions, new technologies, awards, competitions, and standards work. So, relax and make your travel plans as we give you the big reveal! December 2018 Summary There’s no better place to participate in the excitement and innovation of the printed circuit industry than at IPC APEX EXPO 2019. We preview the show, events, exhibitions, new technologies, awards, competitions, and standards work. Experience the magic that is our industry with IPC APEX EXPO. So, relax and make your travel plans as we give you the big reveal! FEATURES: by John Mitchell by Nolan Johnson by Andy Shaughnessy by Barry Matties an interview by the I-Connect007 Editorial Team , an interview by Barry Matties , an interview by Barry Matties by Andy Shaughnessy by Patty Goldman by Patty Goldman by Nolan Johnson by Jan Pedersen by Tara Dunn ARTICLES & COLUMNS: by Philip Carmichael by Andrew McManus by Steve Williams by Michael Carano Close August 2017 08/03/2017IPC APEX EXPO 2020 Preview It's IPC APEX EXPO time again and we’re excited to bring the highlights you can expect to see while in San Diego. In this issue, hear from IPC team members Brook Sandy-Smith, Randy Cherry and Chris Mitchell as they weigh in with their insights on what to expect at this year’s show. January 2020 Summary IPC APEX EXPO is here again. I-Connect007 has been previewing IPC APEX EXPO all month, and we’re excited to bring the highlights you can expect to see while in San Diego. In this issue, Brook Sandy-Smith, IPC technical conference program manager, gives a detailed overview of what attendees can expect in the technical sessions, as well as some new and reconfigured events and resources on the technical conference side. Randy Cherry, IPC Validation Services and Chris Mitchell, IPC’s Government Relations Team weigh in with their insights on what to expect at this year’s show. Features by Nolan Johnson by Chris Mitchell Interview with Randy Cherry Interview with Alex Stepinski by Brook Sandy-Smith Interview with Brook Sandy-Smith by IPC Staff Feature Columns by Dr. John Mitchell by Jan Pedersen by Tara Dunn Columns by Mike Hill by Michael Carano by George Milad by Steve Williams Bonus Content: with Jake Kelly and Marc Ladle with Vladi Kaplan Close September 2018 09/09/2018
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